XingShi produced the specialized SiC cutting tools for semiconductor wires firstly in china in 2000. In 2001 the product took the lead to enter the domestic market and substituted importation. In 2002 the product entered into international market and won appraisal by customers. The product is a national invention patent,and won “domestic origination, international advanced” nationally scientific and technical appraisals. The product was approved as the key national new product by five governmental ministries, and was listed in national technology and trade advancement plan and in High Tech Exporting Product Index of China. With experience accumulated in products and markets, XingShi has established independent technical standards, and has set up a file through the authority standard organization examination and approvals.

     The product can be widely used in solar power industry and large integrated circuit industry, mainly in semiconductor material wire cutting such as for 4-12 inch monocrystalline silicon, polycrystalline silicon, gallium arsenide, quartz crystal, etc.

     Specification: #240～#2500 and other costumed types under request.