2007
★ XingShi’s 6 invention patents incl. specialized SiC cutting tools for semiconductor wires were authorized in China.
★ XingShi set up the national sales & marketing center.
★ XingShi’s SiC new material industrial chain positioning had been completed.
2006
★ NingXia TaoLeYuan Science and Technology Development Co. Ltd. was set up in NingXia.
2005
★ XingShi was awarded as a key exportation high-tech enterprise of HeNan.
★ XingShi achieved the in-situ high pure 6H-SiC technology invention in August.
★ XingShi completed the in-situ high pure 6H-SiC production testing in December.
★ NingXia XingShi Science and Technology Venture Capital Co. Ltd. was set up in December.
2004
★ XingShi established the cooperative relationship with ZhengZhou University Material Engineering School for research and development.
★ The 12,000t specialized SiC cutting tools for semiconductor wires program was listed in national technology and trade advancement plan.
2003
★ XingShi’s specialized SiC cutting tools for semiconductor wires was awarded as National Key New Product by national Science Ministry, Business Ministry, Environment Protection Ministry, Quality Inspection Ministry and Tax Ministry.
★ XingShi’s products were listed in High Tech Exporting Product Index of China.
★ XingShi was awarded as HeNan’s excellent credit system model of foreign trade enterprises.
★XingShi was awarded as the A class management enterprise by HeNan Embarkation/Disembarkation Inspection Bureau.
2002
★ XingShi’s specialized SiC cutting tools for semiconductor wires was certified by HeNan Ministry of Technology and the products entered into international market.
★ XingShi was awarded as the Excellent Private High-Tech Enterprise by HeNan government.
★ XingShi achieved the ISO9001:2000 quality certification.
★ XingShi’s quality testing center passed the assessment by HeNan Embarkation/Disembarkation Inspection Bureau, and registered as the Certified Lab.
2001
★ XingShi’s specialized SiC cutting tools for semiconductor wires ended previous sole importation situation.
★ Approved by HeNan government, Xingshi reformed to joint-stock enterprise.
2000★Succeeded in the research of specialized SiC cutting tools for semiconductor wires, relevant production procedures and facilities.
1999
★ Technologies of “Testing and Production of Coarse Crystal and High Pure SiC and Fine Powder Refinement” and “Recycling of Exhausted Gas during Mining of High Pure SiC Refinement” were certified as provincial technology advancement achievements by Science and Technology Committee of HeNan province.
1998
★ New Efficient Dehydration Method Gas Powder Production Assembly was certified as provincial technology advancement by Science and Technology Committee of HeNan province.
★ Coarse Crystal and High Pure SiC and Fine Powder Program was awarded the second prize of Excellent Porch Program by the national Ministry of Science and Technology, and the first prize of Porch program in HeNan province.
★ XingShi was awarded as the Advanced Porch High Tech Enterprise in HeNan province.
★ XingShi began to export high pure fine SiC powder for engineering ceramics to USA high-tech enterprises, and has been supplying products since then.
★ XingShi was awarded the National Key High-Tech Enterprise by national Ministry of Science and Technology.
1996
★HeNan XingShi High Tech Co. Ltd. registered in High Tech Industry Development District in ZhengZhou of P.R .China.
★Finished the Key National Porch Planning Program of coarse crystal and high pure SiC and fine powders with self-developed patent technology.
